Thermal and/or Electrical Contact Conduction Enhancer
- Summary
- Researchers at Purdue University have developed a product that provides greater conduction at the interface of two surfaces than other removable products. The technology affords this advantage by creating increased contact area at the interface through billions of surface contact sites, and in effect, reduces the thermal and electrical resistance between the two surfaces. This product is versatile enough to be used alone or with existing commercial greases and wax-based PCMs.
- Technology Benefits
- Provides lower thermal and electrical resistance than any other removable interface materialEasily conforms to a variety of surfacesIncreased area of contact between surfacesProvides application to many processes in electronics industry
- Technology Application
- Electronics Industry
- Detailed Technology Description
- Timothy FisherNanoscale Transport Research GroupPurdue Mechanical Engineering
- Countries
- United States
- Application No.
- 8,220,530
- *Abstract
-
- *Background
- In the electronics industry, a common issue is the transfer of heat away from heat producing components and the surrounding components. Continuous contact between the components is not physically possible resulting in an air gap, which is a very poor conductor. Current methods to compensate for these gaps include thermal greases and phase change materials (PCMs), which have efficiency limitations.
- *IP Issue Date
- Jul 17, 2012
- *IP Type
- Utility
- *Stage of Development
- Prototype Testing
- *Web Links
- Purdue Office of Technology CommercializationPurdueInnovation and EntrepreneurshipTimothy FisherPurdue Mechanical Engineering
- Country/Region
- USA
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