Piezoelectric Sensor for Measuring Bonding Parameters
- Summary
- Ultrasonic welding apparatus comprises a sensor ultrasonic welding apparatus and an ultrasonic transducer shaped piezoelectric material between the sensor output of at least two different welding parameters to measure, in order to select the output signal of the welding Parameters have a better signal response.
- Countries
- Hong Kong
- Supplementary Information
- Patent Number: US6279810B1
Application Number: US2000511707A
Inventor: Chan Wong, Lai Wa | Chiu, Siu San | Or, Siu Wing | Cheung, Yiu Ming
Priority Date: 23 Feb 2000
Priority Number: US6279810B1
Application Date: 23 Feb 2000
Publication Date: 28 Aug 2001
IPC Current: G01L000500 | B23K002010 | H01L002160 | H04R001700
US Class: 2280011 | 073579 | 073581 | 228008
Assignee Applicant: ASM Assembly Automation Ltd | The Hong Kong Polytechnic University
Title: Piezoelectric sensor for measuring bonding parameters
Usefulness: Piezoelectric sensor for measuring bonding parameters
Summary: To measure various parameters e.g. impact force, ultrasonic amplitude, and bonding time.
Novelty: Piezoelectric sensor that measures several bonding parameters at the same time during ultrasonic bonding operations when assembling components on a PCB.
- Industry
- Biomedical
- Sub Category
- Medical Imaging
- Application No.
- US2000511707A
- Others
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- Country/Region
- Japan
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