Method for Fabrication of Silicone Composite with Antimicrobial Coating
A method of fabricating silicone composite with a layer of antimicrobial coating, the method includes forming an antimicrobial mixture by adding a calculated amount of antimicrobial agent to a solution of water and alcohol, depositing the antimicrobial mixture in a container with a thickness of 0.1 μm to 10 μm, evaporating the water and alcohol of the antimicrobial mixture to form the layer of antimicrobial coating, adding silicone resin on top of the layer of antimicrobial coating and allow the silicone resin to permeate and crosslink with the layer of antimicrobial coating and removing the silicone composite with the layer of antimicrobial coating from the container.
Patent Number: US8133423B2
Application Number: US2009581889A
Inventor: Tang, Chak Yin | Chen, Da-zhu | Yue, Tai Man | Chan, Yuen Yee
Priority Date: 20 Oct 2009
Priority Number: US8133423B2
Application Date: 20 Oct 2009
Publication Date: 13 Mar 2012
IPC Current: B29D002200 | A61L0002232 | B05D000136 | B28B000500 | B32B000904
US Class: 264240 | 264241 | 422030 | 427258 | 427344 | 4280341 | 428446 | 428448
Assignee Applicant: The Hong Kong Polytechnic University
Title: Method for fabrication of silicone composite with antimicrobial coating
Usefulness: Method for fabrication of silicone composite with antimicrobial coating
Summary: For fabricating silicone composite with antimicrobial coating layer, useful for forming antimicrobial article (claimed), where the antimicrobial articles include catheters and medical tubes to inject fluid and nutrients into arteries and veins, and to drain fluid or urine from urethra or internal organ, which can cause catheter-associated infections (preferably nosocomial infections).
Novelty: Forming silicone composite with antimicrobial coating involves adding antimicrobial in water and alcohol to container, evaporating to form coating, adding silicone resin and allow to permeate and crosslink to coating and removing composite
Chemical/Material
Chemical/Material Application
TANG Chak Yin
CHEN Da-zhu
YUE Tai Man
CHAN Yuen Yee (CUHK)
USA