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Shape Memory Locking Device For Orthopedic Implants

Summary
A Mechanism To Connect The Supporting Portions Of Orthopaedic Implants Such As In The Head, Spine, Upper Limb And Lower Limb And Thereby Prevent Loosening And Fretting At The Implant Interface Of An Orthopaedic Implant Construct Has Been Developed Based On Shape Memory Effect And Super-Elasticity Of Shape Memory Materials Such As Nickel-Titanium (Nitinol Or Niti) Shape-Memory-Alloy, Without The Use Of Typical Threaded Fastening Technique. Advantages Are Conferred By Making The Entire Device, Not Just Connecting Pieces, Out Of Shape Memory Alloy And Having Shape Memory Effect And Super-Elasticity. Heating The Memory Head Of The Device Will Compress The Connection Portion Without The Use Of An Auxiliary Device (E.G. Coupling Member) So That The Connection Portion Can Be Completely Clamped Down By The Memory Head. Further Advantages Are Provided Through The Use Of A Two-Way Shape Memory Effect In Which The Memory Device Can Be Closed Or Tightened By Heating Up The Ambient Temperature, And Re-Opened By Cooling Down The Temperature.
Supplementary Information
Patent Number: HK1135008A1
Application Number: HK2010101798A
Inventor: YEUNG WAI KWOK KELVIN | LU WEIJIA WILLIAM | LUK DIP KEI KEITH | CHEUNG MAN CHEE KENNETH
Priority Date: 13 Sep 2006
Priority Number: HK1135008A1
Application Date: 19 Feb 2010
Publication Date: 2 Nov 2012
Assignee Applicant: The University of Hong Kong
Title: SHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS
Usefulness: SHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS
Summary: Locking mechanism for use in an orthopedic implant for connecting supporting portions in head, spine, upper limb and lower limb (all claimed). Can also be used for connecting a spinal rod and a bone member in a spinal fixation system.
Novelty: Locking mechanism for use in orthopedic implant, has shape memory material with two shapes in memory selected from metal alloys and polymers, where material is nickel-titanium alloy having shape memory and super-elasticity
Industry
Biomedical
Sub Category
Medical Implant
Application No.
US2007853686A
Country/Region
Hong Kong

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