Percolation Efficiency of the Conductivity of Electrically Conductive Adhesives
- Summary
- This is a method which is efficient in improving the percolation efficiency of the electrically conductive adhesives (ECAs). We apply a series of halogens and pseudohalogens for surface pre-modification of the conductive fillers. This treatment can result in the formation of a thin layer of nano-islands at the surface of the metal fillers. These nano-islands are the complexes of metal halides with abundant metal molecular clusters. The size range of these nano-islands is from 0.5 nm to 1 micrometer. They can improve the wettability between the filler and the resin matrix by adjusting the polarity of the metal filler surface. They can also prevent oxidation of the metal filler surface by oxygen, because the abundant metal clusters inside the nano-islands have very strong reducing ability. This treatment method affiliates the electrical conductance of the ECAs.
- Technology Benefits
- 1. An efficient method to improve the conductivity of the electrically conductive adhesives and lowers the percolation threshold.
2. Can have less filling materials (usually are noble metals) to achieve excellent conductivity
- Technology Application
- - Electronic packaging industry
- Logistic industry
- Military industry
- Supplementary Information
- Patent Number: US8231808B2
Application Number: US2009453810A
Inventor: Yang, Cheng | Yuen, Matthew Ming Fai | Xu, Bing
Priority Date: 27 May 2008
Priority Number: US8231808B2
Application Date: 22 May 2009
Publication Date: 31 Jul 2012
IPC Current: H01B000100 | B32B000516 | B32B000900 | H01B000102 | H01B000122
US Class: 252500 | 252513 | 252514 | 428403 | 428407
Assignee Applicant: The Hong Kong University of Science & Technology
Title: Percolation efficiency of the conductivity of electrically conductive adhesives
Usefulness: Percolation efficiency of the conductivity of electrically conductive adhesives
Summary: In interconnection technologies selected from surface mount technology (SMT), chip scale package (CSP), pin-through-hole (PTH), ball grid array (BGA), flip chip technology and stencil printing technology.
Novelty: Electroconductive bonding material formed as modified electrically conductive adhesive comprises thermoplastic polymer resin matrix, and conductive filler material embedded within the matrix and modified by applying halogen/pseudohalogen
- Industry
- Electronics
- Sub Category
- Circuit Design
- Application Date
- 22 May 2009
- Application No.
- US 12/453810
- Patent Information
- US 8231808
- ID No.
- TTC.PA.384
- Country/Region
- Hong Kong
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