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Disposable, High Pressure Microfluidic Chips With Integrated Interconnects

Technology Benefits

Easy to fabricateWithstands pressures over 35 MPaNo contamination of samplesReliable and cost-effectiveWorks with off-the-shelf male fittingsSmall footprint allows for more ports

Technology Application

Connecting plastic microfluidic chips with macroscale tools and devices

Detailed Technology Description

None

Supplementary Information

Patent Number: US20110300034A1
Application Number: US2008304902A
Inventor: Mair, Dieudonne | Geiger, Emil J.
Priority Date: 19 Jun 2006
Priority Number: US20110300034A1
Application Date: 5 May 2009
Publication Date: 8 Dec 2011
IPC Current: B01L009900 | B29C004516
US Class: 422502 | 156245
Assignee Applicant: The Regents of the University of California
Title: Disposable, High Pressure Microfluidic Chips
Usefulness: Disposable, High Pressure Microfluidic Chips
Summary: In unitary microfluidic system (claimed) for biomedical analysis; and for chemical analysis for processes such as catalysis, adsorption and separation.
Novelty: Microfluidic chip for microfluidic system comprises top portion containing first side with groove, and second side with integrated interconnect having opening to provide fluid communication between second side and groove; and bottom portion

Industry

Chemical/Material

Sub Category

Chemical/Material Application

Application No.

20110300034

Others

Related Materials

Injection Molded Microfluidic Chips Featuring Integrated Interconnects; Dieudonne A. Mair, Emil Geiger,Albert P. Pisano,Jean M. J. Fre ´chetand Frantisek Svec*; The Royal Society of Chemistry 2006

Tech ID/UC Case

17765/2007-041-0

Related Cases

2007-041-0

*Abstract

Berkeley Lab and UC Berkeley researchers have invented a plastic microfluidic chip with integrated interconnects. The researchers use inventive mold-making and injection molding processes to fabricate disposable chips with integrated ports that accommodate commercially available male fittings and can withstand pressures over 35 MPa. The ability to perform at these pressures enables the inclusion of porous materials inside the chip channels to increase surface area and provide functionalization, an ability that previously has been limited by interconnect reliability. Monolithic integration of the ports also eliminates the need for extra fabrication steps and contaminating bonding agents.

The novel chip is injection molded as two parts and then thermal fusion or solvent vapor bonded. The inventors have optimized the parameters of the processes to maintain channel shape and ensure a strong bond, achieving low standard deviations in a series of fabrications. The ports have ANSI-standard internal threads to allow a high-pressure reversible fluid connection between micrometer-scale capillaries and the chip ? a connection that facilitates replacement of capillaries damaged at the capillary/chip junction. The ability to accommodate standard fittings also allows users to easily connect the chip channels with commercially available chromatography equipment.

The designs are fabricated from a plastic with low background florescence, which enables the use of laser induced fluorescence (LIF), a very sensitive detection technique. The material's high transmission to ultraviolet (UV) and deep-UV light allows the channel walls to be patterned using UV light.

*IP Issue Date

Dec 8, 2011

*Principal Investigator

Name: Jean M. J. Frechet

Department:

Name: Emil Geiger

Department:

Name: Dieudonne Mair

Department:

Name: Albert Pisano

Department:

Name: Frantisek Svec

Department:

Country/Region

USA