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Disposable, High Pressure Microfluidic Chips With Integrated Interconnects

技术优势

Easy to fabricateWithstands pressures over 35 MPaNo contamination of samplesReliable and cost-effectiveWorks with off-the-shelf male fittingsSmall footprint allows for more ports

技术应用

Connecting plastic microfluidic chips with macroscale tools and devices

详细技术说明

None

附加资料

Patent Number: US20110300034A1
Application Number: US2008304902A
Inventor: Mair, Dieudonne | Geiger, Emil J.
Priority Date: 19 Jun 2006
Priority Number: US20110300034A1
Application Date: 5 May 2009
Publication Date: 8 Dec 2011
IPC Current: B01L009900 | B29C004516
US Class: 422502 | 156245
Assignee Applicant: The Regents of the University of California
Title: Disposable, High Pressure Microfluidic Chips
Usefulness: Disposable, High Pressure Microfluidic Chips
Summary: In unitary microfluidic system (claimed) for biomedical analysis; and for chemical analysis for processes such as catalysis, adsorption and separation.
Novelty: Microfluidic chip for microfluidic system comprises top portion containing first side with groove, and second side with integrated interconnect having opening to provide fluid communication between second side and groove; and bottom portion

主要类别

化工/材料

细分类别

化工/材料应用

申请号码

20110300034

其他

Related Materials

Injection Molded Microfluidic Chips Featuring Integrated Interconnects; Dieudonne A. Mair, Emil Geiger,Albert P. Pisano,Jean M. J. Fre ´chetand Frantisek Svec*; The Royal Society of Chemistry 2006

Tech ID/UC Case

17765/2007-041-0

Related Cases

2007-041-0

国家/地区

美国

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