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LED金屬基板和LED模塊 | LED metal substrate and LED module
Summary
本發明實施例提供了LED金屬基板和LED模塊，通過對LED金屬基板中的電極或者金屬層的側邊或上方覆蓋絕緣體，以對電極和金屬層中的至少一個進行絕緣，還可以通過在LED金屬基板中的電極與金屬層的爬電路徑上設置絕緣體，以增大電極與金屬層之間的爬電間距。無論採用對電極和金屬層中的至少一個進行了絕緣的方式，還是增大電極與金屬層之間的爬電間距的方式，均可以避免在耐壓測試中，當電極所施加的電壓較高時，在電極與金屬層之間產生電弧的這種現象，從而增強了LED金屬基板的耐壓性。
Technology Benefits
解決了現有技術中金屬基板耐壓性較差的技術問題
Technology Application
Lighting
Application Date
2016-08-31
Application No.
CN201610786000.8
Classes
H01L23/485 | H01L23/492 | H01L33/52 | H01L33/62
Coverage Areas
封装模组
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