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Improved 3D Transistor

技术优势
Extremely low operating voltage which lowers operating powerAvoids costly and unusual substrate structures common in 2DLeverages conventional techniques to fabricate 3D transistors
技术应用
Mobile/Portable electronicsData centers and servers
详细技术说明
None
*Abstract
This case helps reinvent the transistor by building on the success of Berkeley’s 3D FinFET/Trigate/Tri-Gate methods and devices, with increased focus on the negative capacitance of the MOS-channel and ferroelectrics, and an unconventional effective oxide thickness approach to the gate dielectric. Proof of concept devices have been demonstrated at 30nm gate length and allow for use of thinner ferroelectric films than 2D negative capacitance transistors (e.g. see http://digitalassets.lib.berkeley.edu/techreports/ucb/text/EECS-2014-226.pdf ). The devices also performed at low operating voltage which lowers operating power.
*IP Issue Date
Jun 8, 2017
*Principal Investigation

Name: ChenMing Hu

Department:

申请号码
20170162702
其他

Tech ID/UC Case

25614/2016-088-0


Related Cases

2016-088-0

国家/地区
美国

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