The current invention utilizes wafer-level assembly and packaging, resulting in a very compact unit (less than 1cm²). By utilizing a folded 3D structure, high aspect ratio single-axis sensors are configured along independent sensitive axes. All devices are fabricated with identical techniques that r.....
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A new hybrid, 3D, Metal, Prototyping Device combines welding technology, instead of laser sintering of a metal powder, with a subtractive/machining process (Computer Numerical Controlled Machining - CNC) to create metal parts with unmatched complexity, precision, and quality. The device has a low, i.....
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The invention is a 3D light fieldcamera that combines a consumer DSLR camera, a cylindrical lens array attachedto the sensor, and a modified lens with a narrow-slit aperture. The camera is capable of diverging rays inone direction, while maintaining high spatial resolution in the otherdirection. S.....
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