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Improved Fabrication of Nonpolar InGaN Thin Films, Heterostructures, and Devices
技术优势
· Variability in layer thickness · Violet and near-ultraviolet light emission · Growth of nonpolar InGaN at a reduced temperature · Growth of InGaN layers at or near atmospheric pressure
技术应用
· LEDs · Laser diodes (LDs)
详细技术说明
UC Santa Barbara researchers have developed a method for fabricating high-quality indium-containing epitaxial layers, heterostructures, and devices based on InGaN growth on GaN substrates. These InGaN films are grown along the nonpolar direction using a metalorganic chemical vapor deposition technique, and result in the successful creation of violet and near-ultraviolet LEDs and LDs. Previous issues related to the growth of InGaN-based devices, such as gross surface roughening, low indium incorporation, and indium desorption in InGaN heterostructures have been overcome with this technique.
申请号码
7186302
其他
Background
GaN and its alloys (AlGaN, InGaN, AlInGaN) have been established as effective for fabrication of visible and ultraviolet optoelectronic devices and high-power electronic devices. These devices are most often grown along the polar c-direction, using a variety of growth techniques, including molecular beam epitaxy (MBE), metalorganic chemical vapor deposition (MOCVD), or hydride vapor phase epitaxy (HVPE). Growing devices in the polar c-direction results in charge separation, spontaneous polarization, and degraded device performance. Growth of such devices along a nonpolar axis could significantly improve their performance, but InGaN-based devices have previously encountered problems with growth conditions and material quality.
Additional Technologies by these Inventors
Reduced Dislocation Density of Non-Polar GaN Grown by Hydride Vapor Phase Epitaxy Growth of Planar, Non-Polar, A-Plane GaN by Hydride Vapor Phase Epitaxy Nonpolar (Al, B, In, Ga)N Quantum Well Design Improved Manufacturing of Semiconductor Lasers Cleaved Facet Edge-Emitting Laser Diodes Grown on Semipolar GaN Etching Technique for the Fabrication of Thin (Al, In, Ga)N Layers Enhancing Growth of Semipolar (Al,In,Ga,B)N Films via MOCVD GaN-Based Thermoelectric Device for Micro-Power Generation Growth of High-Quality, Thick, Non-Polar M-Plane GaN Films Method for Growing High-Quality Group III-Nitride Crystals Growth of Planar Semi-Polar Gallium Nitride Defect Reduction of Non-Polar and Semi-Polar III-Nitrides MOCVD Growth of Planar Non-Polar M-Plane Gallium Nitride Lateral Growth Method for Defect Reduction of Semipolar Nitride Films Low Temperature Deposition of Magnesium Doped Nitride Films Growth of Polyhedron-Shaped Gallium Nitride Bulk Crystals Improved Manufacturing of Solid State Lasers via Patterning of Photonic Crystals Novel Current-Blocking Layer in High-Power Current Aperture Vertical Electron Transistors (CAVETs) Control of Photoelectrochemical (PEC) Etching by Modification of the Local Electrochemical Potential of the Semiconductor Structure Phosphor-Free White Light Source Single or Multi-Color High Efficiency LED by Growth Over a Patterned Substrate High Efficiency LED with Optimized Photonic Crystal Extractor Packaging Technique for the Fabrication of Polarized Light Emitting Diodes LED Device Structures with Minimized Light Re-Absorption (In,Ga,Al)N Optoelectronic Devices with Thicker Active Layers for Improved Performance Polarization-Doped Field Effect Transistors with Increased Performance Oxyfluoride Phosphors for Use in White Light LEDs III-V Nitride Device Structures on Patterned Substrates Growth of Semipolar III-V Nitride Films with Lower Defect Density Improved GaN Substrates Prepared with Ammonothermal Growth High-Quality N-Face GaN, InN, AlN by MOCVD Enhanced Optical Polarization of Nitride LEDs by Increased Indium Incorporation Semipolar-Based Yellow, Green, Blue LEDs with Improved Performance Hexagonal Wurtzite Type Epitaxial Layer with a Low Alkali-Metal Concentration Photoelectrochemical Etching Of P-Type Semiconductor Heterostructures Photoelectrochemical Etching for Chip Shaping Of LEDs Highly Efficient Blue-Violet III-Nitride Semipolar Laser Diodes Method for Manufacturing Improved III-Nitride LEDs and Laser Diodes: Monolithic Integration of Optically Pumped and Electrically Injected III-Nitride LEDs Defect Reduction in GaN films using in-situ SiNx Nanomask Semi-polar LED/LD Devices on Relaxed Template with Misfit Dislocation at Hetero-interface Limiting Strain-Relaxation in III-Nitride Heterostructures by Substrate Patterning Suppression of Defect Formation and Increase in Critical Thickness by Silicon Doping High Efficiency Semipolar AlGaN-Cladding-Free Laser Diodes Low-Cost Zinc Oxide for High-Power-Output, GaN-Based LEDs (UC Case 2010-183) Low-Cost Zinc Oxide for High-Power-Output, GaN-Based LEDs (UC Case 2010-150) Nonpolar III-Nitride LEDs With Long Wavelength Emission Method for Growing Self-Assembled Quantum Dot Lattices Method for Increasing GaN Substrate Area in Nitride Devices GaN-based Vertical Metal Oxide Semiconductor and Junction Field Effect Transistors Flexible Arrays of MicroLEDs using the Photoelectrochemical (PEC) Liftoff Technique Optimization of Laser Bar Orientation for Nonpolar Laser Diodes UV Optoelectronic Devices Based on Nonpolar and Semi-polar AlInN and AlInGaN Alloys Low-Droop LED Structure on GaN Semi-polar Substrates Growth of High-Performance M-plane GaN Optical Devices Method for Enhancing Growth of Semipolar Nitride Devices Transparent Mirrorless (TML) LEDs Solid Solution Phosphors for Use in Solid State White Lighting Applications Technique for the Nitride Growth of Semipolar Thin Films, Heterostructures, and Semiconductor Devices Planar, Nonpolar M-Plane III-Nitride Films Grown on Miscut Substrates High-Efficiency, Mirrorless Non-Polar and Semi-Polar Light Emitting Devices High Light Extraction Efficiency III-Nitride LED Tunable White Light Based on Polarization-Sensitive LEDs Method for Improved Surface of (Ga,Al,In,B)N Films on Nonpolar or Semipolar Subtrates Improved Anisotropic Strain Control in Semipolar Nitride Devices III-Nitride Tunnel Junction with Modified Interface Enhanced Light Extraction LED with a Tunnel Junction Contact Wafer Bonded to a Conductive Oxide Increased Light Extraction with Multistep Deposition of ZnO on GaN Hybrid Growth Method for Improved III-Nitride Tunnel Junction Devices Calcium Impurity Reduction for Improved Light-Emitting Devices Contact Architectures for Tunnel Junction Devices New Blue Phosphor for High Heat Applications A Structure For Increasing Mobility In A High-Electron-Mobility Transistor Internal Heating for Ammonothermal Growth of Group-III Nitride Crystals III-N Based Material Structures and Circuit Modules Based on Strain Management Methods for Fabricating III-Nitride Tunnel Junction Devices Achieving “Active P-Type Layer/Layers” In III-Nitride Epitaxial Or Device Structures Having Buried P-Type Layers Improved Performance of III-Nitride Photonic Devices Multifaceted III-Nitride Surface-Emitting Laser Laser Diode System For Horticultural Lighting Fabricating Nitride Layers Reduction in Leakage Current and Increase in Efficiency of III-Nitride MicroLEDS Vertical Cavity Surface-Emitting Lasers with Continuous Wave Operation Laser Lighting System Incorporating an Additional Scattered Laser Gated Electrodes For Electrolysis And Electrosynthesis Fabrication of N-face to Improve Telecommunications Efficiency Methods for Locally Changing the Electric Field Distribution in Electron Devices Tech ID/UC Case
25014/2004-495-0
Related Cases
2004-495-0
国家/地区
美国
