Preparation and Development of Pb-free Nanosolder Enhanced Composite Solder Paste for Improved Joint Strength.
Pb-free compositioncomplies with many health and toxicology standards for electronicsmanufacturing.Maintains similar physical characteristics as previously used Pb-based solders.Nanoscale solder can beused for smaller-sized applications.Lower meltingtemperature leads to less thermal stress being placed on the devices as well asenergy conservation in the assembly process.Nanosolder additives ofsimilar composition to the microsolder paste increases the mechanical strengthof joints.
Two novel soldering techniques utilizing lead-free (Pb-free) nanosolder paste with physical characteristics comparable to those of Pb-based solders with a decreased melting temperature composed of tin and silver (Sn/Ag) and tin, silver and copper (SAC) alloys for microelectronic applications.
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