AsiaIPEX is a one-stop-shop for players in the IP industry, facilitating IP trade and connection to the IP world. Whether you are a patent owner interested in selling your IP, or a manufacturer looking to buy technologies to upgrade your operation, you will find the portal a useful resource.

Back to search results

Preparation and Development of Pb-free Nanosolder Enhanced Composite Solder Paste for Improved Joint Strength.

Technology Benefits: Pb-free compositioncomplies with many health and toxicology standards for electronicsmanufacturing.Maintains similar physical characteristics as previously used Pb-based solders.Nanoscale solder can beused for smaller-sized applications.Lower meltingtemperature leads to less thermal stress being placed on the devices as well asenergy conservation in the assembly process.Nanosolder additives ofsimilar composition to the microsolder paste increases the mechanical strengthof joints.

Detailed Technology Description: Two novel soldering techniques utilizing lead-free (Pb-free) nanosolder paste with physical characteristics comparable to those of Pb-based solders with a decreased melting temperature composed of tin and silver (Sn/Ag) and tin, silver and copper (SAC) alloys for microelectronic applications.

*Abstract

*Background: Soldering techniques have been used in themanufacturing of electronic devices for many years and were historically composedof a tin and lead (Sn/Pb) alloy material. Specifically, solder paste, or amixture of solder balls and solvent, is used for the bonding and assembly ofelectrical components commonly with a ball grid array (BGA) technique forsurface mounting packaging. However, lead has been phased out from mostelectronics due to toxicology and health concerns. New solder compositions havebeen developed to take the place of lead solders, including variouscompositions of tin, silver and copper, but these replacements have a muchhigher melting point than lead solders at approximately 220°C and above. High melting temperatures require the solder to be heatedto a higher temperature during the reflow process, which requires greaterenergy consumption and places a large amount of thermal stress on the circuitboard. An innovative solder paste for these applications is necessary for the expandingmicroelectronics industry that has a low melting temperature and can beutilized in nanoscale applications.

Country/Region: USA

For more information, please click Here