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Shell-Activated Sintering of Core-Shell Particles
总结
Purdue University researchers have developed a new interconnect technology based on low temperature sintering, replacing traditional solder joints, as well as high Pb and silver solder alloys, used for high temperature attach of semiconductor die to substrate. This technology lowers the processing temperature, improves interconnect characteristics, and minimizes the tin "whiskers."
技术优势
Improved interconnect characteristicsMinimizes tin "whiskers"
技术应用
MaterialsManufacturing
详细技术说明
Carol HandwerkerDesign LabPurdue Materials Engineering
国家
United States
申请号码
None
国家/地区
美国
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