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Polymer-Based Heterogeneous Integration Technology
总结
Researchers at Purdue University have developed a new approach to remove the packaging and bulky passive elements from expensive active chips and fabricate them within a less expensive carrier substrate; therefore, reducing the cost of the integrated system.
技术优势
Reduces size and costDecreases parasitic capacitance More reliable and efficient
技术应用
MaterialsManufacturingMicroelectronicsNanoelectronics
详细技术说明
Saeed MohammadiPurdue Electrical and Computer Engineering
国家
United States
申请号码
7,473,579
国家/地区
美国
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