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Solventless, Resistless, Direct Dielectric Patterning


Detailed Technology Description

A novel process was developed for lithographically patterning a material on a substrate that greatly reduces wastes to provide a much more environmentally and economically friendly microelectronics fabrication method.


Others

Patents: 6,509,138; 171285; 6,946,736; EP1269259;


Country/Region

USA

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