Mechanical Process For Creating Particles Using Two Plates
More Cost Effective- in IC manufacturing, lithography typically accounts for about 30 % of the cost of manufacturingDon’t need to be run continuouslyHigher throughput levels System and run particle formation in parallel
Patterning microelectronic and nanoelectronic structures and circuitsMicroelectromechanical systems (MEMS) devicesIntegrated circuits for use in electronic devicesPCB design for use in electronic devicesAccelerometersGyroscopesPressure SensorsChemical and Gas Sensors
Researchers at UCLA have developed a novel method for microparticle fabrication that is more efficient than the current lithographic practices of using optical exposure to create LithoParticles. The basic concept is to make microscale and nanoscale particles by 1) using a solid patterned form, 2) depositing a material into the form made using lithography to 3) create discontiguous depressions or other predetermined discrete features (i.e. desired particle shapes) 4) turning the deposited material into a solid (if it is not already) and 5) separating the solid particulates of deposited material from the patterned form which usually involves dispersing the particles in fluid.With a solid patterned form, which can be re-used, particles can be made without the need for complex expensive exposure systems such as optical lithography or electron-beam lithography. This lithographic process provides robust means of producing shape-designed particles in parallel at higher throughput levels than single optical systems.
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Background This technology relates to the process and system for making microparticles and nanoparticles. Applications include lithography and patterning microelectronic and nanoelectronic structures for MEMS technology. The global market for MEMS devices and production equipment was worth $11.7 billion in 2014. This market is expected to reach $12.8 billion in 2015 and $21.9 billion by 2020. In the internet of things, MEMS technology, as well as microscopic particle production, is heavily utilized in commercial applications. Additional Technologies by these Inventors Tech ID/UC Case 27482/2007-234-0 Related Cases 2007-234-0
USA
