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Graphen Layer Formation On A Carbon Based Substrate

Technology Benefits

Outperforms the current fabrication methods that use Si/SiO2 substrates: retains thermal conductivity, improves current-carrying capacity of graphene-on-diamond devices, easy preparation & scalabilityOutperforms heat conduction of plastics by 600-times

Detailed Technology Description

None

Application No.

8652946

Others

Images

Applications

Thermal coating material for plastics, e.g. electronic component packaging, solid state lighting

Tech ID/UC Case

25912/2015-254-1

Related Cases

2015-254-1

Country/Region

USA

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