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Use of Photosensitized Epon Epoxy Resin 1002F for MEMS and BioMEMS Applications

Technology Application

This invention teaches the use of the Resin for microdevices and for biomedical devices. This invention also teaches various methods of manufacture when using the Resin to build microdevices and biomedical devices. The use of the Resin is novel in this field of use and this material is not currently used for this purpose.

Detailed Technology Description

We have found that a certain resin ("Resin") can be made photosensitive in the same way as SU-8, but is neither brittle nor fluorescent. The Resin is already readily available in industry. The technology is directed to the use of the Resin as a material for lithographically fabricating microdevices. Through the addition of a photosensitizing agent, it can be cross-linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. The Resin is a polymer that has epoxide groups in its monomer form. When these monomers are cross-linked, they form two-dimensional sheets, resulting in a thermoplastic material that has lower strength and rigidity, but can tolerate greater stress before failure. Also, we have observed that the Resin material has lower fluorescence properties than SU-8.

Application No.

8748085

Others

Tech ID/UC Case

18735/2007-706-0

Related Cases

2007-706-0

Country/Region

USA

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