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Self-Curved Diaphragms By Stress Engineering For Highly Responsive pMUT


Technology Benefits

- 95% wafer utilization- Foundry-based CMOS process- Frequency tuning to desired value- Both low frequency and high frequency pMUT arrays


Technology Application

- Ultrasonic gesture recognition- Range finding- Finger print identification- Medical imaging and diagnosis- Sensors in hand-held devices


Detailed Technology Description

None


Application No.

WO2015112452


Others

Additional Technologies by these Inventors


Tech ID/UC Case

24472/2015-050-0


Related Cases

2015-050-0


Country/Region

USA

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