Search
  • Within this site
AsiaIPEX is a one-stop-shop for players in the IP industry, facilitating IP trade and connection to the IP world. Whether you are a patent owner interested in selling your IP, or a manufacturer looking to buy technologies to upgrade your operation, you will find the portal a useful resource.
Back to search results

Ultra-low Loss Hollow-core Waveguides


Technology Benefits

Ultra-low loss, Low propagation loss, High fabrication tolerance


Technology Application

On-chip optical communication, Compact optical delay line, Advanced optical filters, True-time delay for phased array antennas, Data packet traffic engineering Interferometric sensors.


Detailed Technology Description

None


Supplementary Information

Patent Number: US8442374B2
Application Number: US13109205A
Inventor: Chang-Hasnain, Connie | Zhou, Ye | Karagodsky, Vadim | Sedgwick, Forrest G. | Huang, Michael Chung-Yi
Priority Date: 25 Nov 2008
Priority Number: US8442374B2
Application Date: 17 May 2011
Publication Date: 14 May 2013
IPC Current: G02B000634 | G02B0006036 | G02B000610
US Class: 385129 | 385037 | 385131
Assignee Applicant: The Regents of the University of California
Title: Ultra-low loss hollow core waveguide using high-contrast gratings
Usefulness: Ultra-low loss hollow core waveguide using high-contrast gratings
Summary: Apparatus for guiding light propagated through high contrast grating-hollow waveguides (HCG-HW) for compact optical delay line, advanced optical filters, true time delay phased array antennas, data packet traffic engineering, interferometric sensors and on-chip optical communication.
Novelty: Apparatus for guiding light propagated through high contrast grating-hollow waveguides (HCG-HW), has core that receives incident light beam between gratings and provides lateral confinement in response to glancing reflections


Industry

Biomedical


Sub Group

Medical Implant


Application No.

8442374


Others

Tech ID/UC Case

18056/2009-057-0


Related Cases

2009-057-0


Country/Region

USA

For more information, please click Here
Business of IP Asia Forum
Desktop View