Method Of Fabricating Patterned Surfaces With Nanoparticles And Nanowires
Simple and direct method for selective deposition of metallic nanoparticles with nanometer-scale precision.
This method can form the basis for fabricating electronically conducting features, waveguides, and other devices for nano- electronic and photonic applications.
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Patent Number: US7687145B2
Application Number: US2005244446A
Inventor: Frechet, Jean M. J. | Fresco, Zachary M.
Priority Date: 4 Oct 2004
Priority Number: US7687145B2
Application Date: 4 Oct 2005
Publication Date: 30 Mar 2010
IPC Current: B32B000516 | C01F000702 | C01F000708
US Class: 428403 | 428221 | 428704 | 556427 | 556429 | 556437 | 556449 | 556465 | 556482 | 556489
Assignee Applicant: The Regents of the University of California
Title: Compounds containing a thiol protected group bonded to a protecting group via a polarized bond, and structure comprising the compounds on its surface
Usefulness: Compounds containing a thiol protected group bonded to a protecting group via a polarized bond, and structure comprising the compounds on its surface
Summary: The organic compound, e.g. 3,5-dimethoxy-α,α-dimethylbenzyloxycarbony1-3-mercaptopropyltriethoxysilane, is used for forming protected thiol-containing reactive organic layer for nanoscale structure (claimed). It is used in the formation of patterns of electrically conductive nanoparticles, e.g. gold nanoparticles or silver nanoparticles, useful in nanoelectronics and photonics e.g. as electrically conducting wires, as plasmon wave guides for photonic devices or as seeds for the growth of silicon nanorods.
Novelty: Organosulfur compound as protected thiol-containing reactive layer precursor used in forming nanoscale structure, comprises protected thiol functional group, and protecting group bonded to protected functional group
Chemical/Material
Chemical/Material Application
7687145
Tech ID/UC Case 17447/2005-010-0 Related Cases 2005-010-0
USA
