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Method For Constructing Structures Using Nanoparticles

Technology Benefits

Superior fabrication flexibility, reliability and economics due to the elimination of substrate recesses

Technology Application

Metallic and non-metallic structure generationMEMSSuperconductors

Detailed Technology Description

None

Supplementary Information

Patent Number: US7087523B2
Application Number: US2003621046A
Inventor: Grigoropoulos, Constantine P. | Bieri, Nicole Renée | Poulikakos, Dimos | Chung, Jaewon
Priority Date: 10 Jan 2001
Priority Number: US7087523B2
Application Date: 16 Jul 2003
Publication Date: 8 Aug 2006
IPC Current: H01L002144 | H01L002148 | H01L0021768 | H05K000310 | H05K000312
US Class: 438662 | 257E21582 | 438962
Assignee Applicant: The Regents of the University of California
Title: Method for producing a structure using nanoparticles
Usefulness: Method for producing a structure using nanoparticles
Summary: For forming e.g. polymer structure on substrate such as semiconductor wafer, using nanoparticles of gold in liquid e.g. toluene, terpineol, xylene, water, used for desktop production of simple electrode components, wire bonding.
Novelty: Substrate structure formation method, involves depositing liquid suspension of gold nanoparticles on substrate and solidifying partially molten nanoparticles

Industry

Electronics

Sub Group

Semiconductor

Application No.

7087523

Others

Related Technologies

Thin Film Crystal Growth By Laser Annealing

Tech ID/UC Case

17086/2001-108-0

Related Cases

2001-108-0

Country/Region

USA

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