Microneedles Formed Vertically Within A Semiconductor Substrate
Needles may be formed with various slopes and tip shapes for specific applicationsNeedle arrays may be fabricatedProduces low cost and highly reproducible structures
Transdermal drug deliveryInjection or extraction of gases, fluids or suspensionsNeedle arrays may be used to pattern a structureInterface with instrumentation
None
Patent Number: US6406638B1
Application Number: US2000478913A
Inventor: Stoeber, Boris | Liepmann, Dorian
Priority Date: 6 Jan 2000
Priority Number: US6406638B1
Application Date: 6 Jan 2000
Publication Date: 18 Jun 2002
IPC Current: B81C000100 | A61M0005158 | A61M000532 | A61M003700 | B81B000100 | H01L002166
US Class: 216011 | 216002 | 216049 | 216079 | 438712 | 438713 | 438719
Assignee Applicant: The Regents of the University of California
Title: Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby
Usefulness: Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby
Summary: The method is used for forming a needle which is used for biomedical applications used to inject gases, fluids, suspensions and for extracting gases, and liquid and also employed in instrumentation and for guiding electromagnetic waves.
Novelty: Needle fabrication for biomedical application, comprises forming a channel and vertical axial surface in back and front sides of a substrate by anisotropic and isotropic etching, respectively
Electronics
Semiconductor
6406638
Tech ID/UC Case 16918/2000-043-0 Related Cases 2000-043-0
USA
