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HIGHLY PLASMA ETCH-RESISTANT PHOTORESIST COMPOSITION CONTAINING A PHOTOSENSITIVE POLYMERIC TITANIA PRECURSOR

IP Title

Detailed Technology Description

None

Supplementary Information

Patent Number: US6303270B1
Application Number: US1999259229A
Inventor: Flaim, Tony D. | Guerrero, Douglas J. | Fowler, Michelle R. | James, William J. | Petrovsky, Vladimir | Anderson, Harlan U.
Priority Date: 1 Mar 1999
Priority Number: US6303270B1
Application Date: 1 Mar 1999
Publication Date: 16 Oct 2001
IPC Current: C08G007900 | G03F0007004 | G03F0007038
US Class: 4302841 | 4302851 | 4302871 | 430311 | 525389 | 528220 | 528395
Assignee Applicant: The Curators of the University of Missouri,Rolla | Brewer Science Inc,Rolla
Title: Highly plasma etch-resistant photoresist composition containing a photosensitive polymeric titania precursor
Usefulness: Highly plasma etch-resistant photoresist composition containing a photosensitive polymeric titania precursor
Summary: For defining patterns on substrates, especially as a photoresist composition for microlithographic applications.
Novelty: Plasma etch-resistant photoresist composition for defining patterns on substrates, especially in microlithographic applications, contains organotitanium (co)polymer reaction product, photopolymerization initiator and solvent

Industry

Chemical/Material

Sub Group

Chemical/Material Application

Application Date

Mar 1, 1999

Application No.

6,303,270

Others

Country/Region

USA

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