Cube Sensor (A Platform Technology for Flexible Electronic Devices)

This technology follows a process that enables the production of flexible and transparent substrates such as mono-­crystalline silicon that can be used as a platform for semiconductor printing and wiring in electronic devices. The process is cost­-effective and can be made compatible with the conventional CMOS process. It involves various steps of oxidation, etching, implantation, and masking to create vertical channels across the substrate in a controlled manner. Once this has been achieved, anisotropic etching can be done smoothly before peeling off a thin layer of the substrate that can be monitored down to sub-­micron levels in thickness. The resulting substrate from this technology has excellent properties of optical transparency, mechanical flexibility and strength.

USA