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Innovative and Versatile System for Measurement of Thickness, Uniformity, Delamination, and Integrity of In Situ Thin Films
Detailed Technology Description
This technology is a new method for measuring the thickness and integrity of thin films (nanometer to micron thickness), primarily those deposited on semiconductor substrates, although it is broadly applicable to many material systems.
Countries
United States
Application No.
7301149
Country/Region
USA
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