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Micropump for High Heat Flux Cooling

Summary

Purdue University researchers have developed a novel device that overcomes these problems, a micropump that can meet the aggressive requirements of microchannel heat sinks. The pump has the potential to offer very high flow rates and has excellent miniaturization potential. In addition, it has a low input power requirement and can be fully integrated into the microchannel heat sinks. Moreover, with a variation of the pump design, high pressure heads can be generated at both the inlet and outlet of the microchannels and in the overall flow loop, rendering the use of an external pump to drive the fluid through the external heat exchanger unnecessary.

Technology Benefits

Capable of achieving higher flow rates and pressure heads than currently available pump designsMinaturizable down to hundreds of micrometers; thus, making it suitable for use in integrated cooling systems Fully compatible with silicon microfabrication processesNo limitation on the types of working fluids that can be pumped

Technology Application

MicroelectronicsNanoelectronicsManufacturing

Detailed Technology Description

Suresh GarimellaCooling Techniques Research CenterPurdue Mechanical Engineering

Countries

United States

Application No.

7,802,970

Country/Region

USA

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