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Processing method of Cu alloy to get high coincident site lattice ratio grain boundaries

Technology Benefits

-A drop-in processing method to enhance the properties of common alloys by very large factors (10x)-More effective than previously known grain boundary engineering (GBE) processes-Avoids time and energy-consuming heating or cooling steps-Applicable to various kinds of FCC metals, specifically applicable to those that precipitate second phases

Technology Application

High-purity metals including various kinds of face centered cubic (FCC) metals such as pure copper, other copper alloys, brass, pure nickel, nickel alloys and various kinds of austenitic stainless steels for-Uniformity of dissolution for anode materials. (Cu, Ni and their alloys etc.)-Higher mechanical strength and higher resistivity to softening during usage time as electric connecting plate materials. (Cu and Cu alloys)-Creep resistance at elevated temperatures-Weldability and hot cracking resistance-Stress-corrosion cracking resistanceThese properties and others can be enhanced by very large factors (up to 10x) by grain boundary engineering (GBE).

Detailed Technology Description

None

Country/Region

USA

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