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發光裝置復合基板及具有該發光裝置復合基板的LED模組 | Light-emitting device composite substrate and light emitting diode (LED) module with same
Summary
本發明涉及一種發光裝置復合基板及具有該發光裝置復合基板的LED模組。其中，發光裝置復合基板包括金屬基底、絕緣載體與電極，所述金屬基底與所述絕緣載體分別具有相對的正面和背面，所述絕緣載體位於所述金屬基底外圍且與所述金屬基底固定連接，所述電極位於所述絕緣載體上，所述電極貫穿所述絕緣載體，所述電極具有相對的正面和背面，所述絕緣載體的背面及所述電極的背面的高度小於所述金屬基底的背面的高度。本發明還提供一種LED模組。
Technology Benefits
降低成本。
Technology Application
Lighting
Application Date
2015-07-17
Application No.
CN201510423059.6
Classes
H01L33/62 | H01L33/48
Coverage Areas
封装模组
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