Media.Player

Heat Dissipation Structure with Aligned Carbon Nanotube Arrays and Methods for Manufacturing and Use具有用碳納米管作熱界面材料的封裝及其製造方法

Summary

With the development of microelectronic systems, significant challenge of thermal management has to be faced to meet the increasing requirements such as smaller profile, higher performance and longer product lifetime. Conventional thermal interface materials, such as thermal grease, thermal adhesives, and phase change materials, cannot meet the increasing requirement of the heat dissipation from small area.

The present invention provides a low cost and simple process thermal management solution to electronic packaging by using high thermal conductivity carbon nanotube arrays. The carbon nanotubes are aligned for greatest thermal conductivity. They grow on the heat spreader surface as thermal interface material dissipating heat directly from a heat source surface to a heat sink surface. This can simplify the fabrication process and reduce the production cost. In some embodiments, a connecting layer may be formed on the coupling surfaces of heat source and heat sink. It helps the carbon nanotube arrays to connect to both surfaces. Good bonding formed by direct growth of carbon nanotube arrays on coupling surfaces is benefit to reduce the thermal contact resistance.

The invention can be applied in heating devices or heating components.

Technology Benefits

1. Simple fabrication process
2. Low production cost
3. Smaller thermal contact resistance
4. No microelectronic fabrication is needed

Technology Application

- Heat spreader for microelectronic systems

Supplementary Information

Patent Number: CN101083234B
Application Number: CN200710106382A
Inventor: YUAN, Ming-hui | ZHANG, Kai
Priority Date: 26 May 2006
Priority Number: CN101083234B
Application Date: 28 May 2007
Publication Date: 19 Jun 2013
IPC Current: H01L002334
Assignee Applicant: The Hong Kong University of Science & Technology
Title: Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use | Radiating structure and its manufacturing and application is provided with well-aligned carbon nanobtube array carbon nano-tube array.
Usefulness: Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use | Radiating structure and its manufacturing and application is provided with well-aligned carbon nanobtube array carbon nano-tube array.
Summary: For high brightness LED (HB-LED) package.
Novelty: Packaged semiconductor structure for high brightness LED package, has carbon nanotube arrays grown on both sides of substrate of heat sink, which thermally connect heat source to heat sink

Industry

Electronics

Sub Category

Semiconductor

Application Date

28 May 2007

Application No.

Chinese 200710106382.6

Patent Information

Chinese ZL200710106382.6

ID No.

TTC.PA.295S

Country/Region

Hong Kong