Assemblies of Ultrathin, Microscale Vertical Cavity Surface Emitting Lasers
- 技術優勢
- VCSELs can be transferred to nearly any substrate including soft, non-planar surfaces without any defectsAllows precisely-controlled spatial layoutsCost-effective and scalableThin, light-weight, and flexible constructionReuse of the growth substrate
- *Abstract
-
USC researchers have devised a novel epitaxial design and fabrication process, along withprinting-based integration techniques, enabling defect-free release ofultrathin, microscale vertical cavity surface emitting lasers (VCSELs) andtheir device level implementation on non-native substrates in a cost-effectivemanner. The process defines a device layout that allows the VCSELs to beprinted on nearly any class of material and a simplified procedure for definingmetal interconnects. The process allows fully functional micro-VCSELs to bereleased defect free from the growth wafer using an elastomeric stamp andtransferred to a non-native substrate, including soft, non-planar surfaces,using photo or thermally curable adhesives.
- 國家/地區
- 美國
欲了解更多信息，請點擊 這裡
