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Assemblies of Ultrathin, Microscale Vertical Cavity Surface Emitting Lasers

技术优势

VCSELs can be transferred to nearly any substrate including soft, non-planar surfaces without any defectsAllows precisely-controlled spatial layoutsCost-effective and scalableThin, light-weight, and flexible constructionReuse of the growth substrate

*Abstract

USC researchers have devised a novel epitaxial design and fabrication process, along withprinting-based integration techniques, enabling defect-free release ofultrathin, microscale vertical cavity surface emitting lasers (VCSELs) andtheir device level implementation on non-native substrates in a cost-effectivemanner. The process defines a device layout that allows the VCSELs to beprinted on nearly any class of material and a simplified procedure for definingmetal interconnects. The process allows fully functional micro-VCSELs to bereleased defect free from the growth wafer using an elastomeric stamp andtransferred to a non-native substrate, including soft, non-planar surfaces,using photo or thermally curable adhesives.

国家/地区

美国