Electrowetting Based Pick and Place Assembly Device
- 詳細技術說明
- A material handling device based on electrowetting was designed for high-volume assembly of micron-sized objects.
- *Abstract
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A material handling device based on electrowetting was designed for high-volume assembly of micron-sized objects. The device includes a flat plate with an array of electrically controlled nodes that switch their adhesion property based on the voltage supply. Designed to accurately pick up and place millions of micro-meso tiles in parallel, the system is also low-maintenance and self-cleaning due to the adhesion-switching approach. This novel technology has application primarily to assist 3D printers in assembly but could also be applied to heavy objects.
- *Licensing
- Jessica Lyga jml73@cornell.edu (607) 255-0270
- 其他
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Patent application: PCT/US13/50650
- 國家/地區
- 美國
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