High Strength Low K Insulators for Integrated Circuits Applications
- 詳細技術說明
- None
- *Abstract
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A polymer comprises at least two types of monomer units selected from: (1) diethynyl benzene units, (2) triethynyl benzene units, and (3) ester units. After curing, the polymer may form a condensed polyaromatic dielectric having a dielectric constant of at most 2.0 at 1 MHz, an elastic modulus of at least 7.7 GPa, and a hardness of at least 2.0 GPa.
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- *IP Issue Date
- None
- *IP Type
- Other Patent
- 國家
- Not Available
- 申請號碼
- None
- 國家/地區
- 美國
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