ELECTRONIC DEVICES IN PLASTIC
- 总结
- The invention concerns methods for forming an electronic device in plastic. In another aspect, the invention concerns an electronic device formed according to the method.
- 技术优势
- Enables the production of electronic components to be housed in unique situations required by Industry.
- 技术应用
- Electronic Manufacturing
- 详细技术说明
- The invention concerns a method for forming an electronic device in plastic. The method for forming an electronic device in plastic comprises: (a) placing electronic components in recesses in a thermoplastic substrate; (b) depositing an electronic circuit over the electronic components or onto a thermoplastic sheet; and (c) bonding the thermoplastic substrate with the thermoplastic sheet in a thermal bonding process to seal the electronic components and the electronic circuit between the thermoplastic substrate and the thermoplastic sheet wherein the method further comprises providing a thermally conductive layer on the thermoplastic sheet and/or substrate such that heat applied during the thermal bonding process is distributed uniformly across the thermoplastic sheet and/or substrate to facilitate bonding of the thermoplastic sheet and substrate. In another aspect, the invention concerns an electronic device formed according to the method. It is an advantage that a more uniform heat distribution is achieved.
- 合作类型
- Licensing
- 申请日期
- 30/10/2009 00:00:00
- 申请号码
- 2009233620
- 国家/地区
- 澳洲
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