Improved Rapid Bonding Of Silicon To Steel
- Technology Benefits
- Cool enough to prevent damage to the bonded partsFast enough for cost-effective assembly line manufacturing
- Technology Application
- Bonding silicon based sensors and circuits to steel-based devices and structures -- for example, bonding a MEMS strain sensor to rolling element bearing enabling the in-situ sensing of road conditions and bearing wear.
- Detailed Technology Description
- None
- Supplementary Information
- Patent Number: US7452800B2
Application Number: US2006598244A
Inventor: Sosnowchik, Brian D. | Lin, Liwei | Pisano, Albert P.
Priority Date: 9 Nov 2005
Priority Number: US7452800B2
Application Date: 9 Nov 2006
Publication Date: 18 Nov 2008
IPC Current: H01L002144
US Class: 438615 | 257E21084
Assignee Applicant: The Regents of the University of California
Title: Bonding a non-metal body to a metal surface using inductive heating
Usefulness: Bonding a non-metal body to a metal surface using inductive heating
Summary: For bonding a non-metal body to a metal surface, e.g. for bonding silicon chip to steel for sensor applications.
Novelty: Non-metal body to metal surface bonding, e.g. silicon chip to steel for sensor applications, comprises inductive heating of heat-activated bonding agent to bond non-metal body to metal surface
- Industry
- Chemical/Material
- Sub Category
- Metal Material
- Application No.
- 7452800
- Others
-
Related Technologies
Tech ID/UC Case
17566/2005-131-0
Related Cases
2005-131-0
- *Abstract
-
Most micro-sensors and integrated circuits are made using silicon, and most metallic structural materials and devices are made using steel. Accordingly, the capability to bond Si-based sensors and circuits to steel-based devices and structures could lead to many potential applications. However bonding these two materials without damaging either of them is difficult. Furthermore in order to make the bonded product cost-effective, the bonding must be performed in seconds on an assembly line process. The conventional method for bonding devices to steel is by using epoxy adhesive, but the cure time is long, the modulus of elasticity is low, and the resilience in harsh environments is questionable.
To address this problem, researchers at UC Berkeley have developed an innovative method for bonding silicon to steel. This method's bonding temperature is low enough to not damage the steel's heat treatment or the silicon part; and the bonding is achieved in seconds. Moreover, the bonding heat can be localized thereby reducing energy costs and possible residual heat damage.
- *IP Issue Date
- Nov 18, 2008
- *Principal Investigator
-
Name: Liwei Lin
Department:
Name: Albert Pisano
Department:
Name: Brian Sosnowchik
Department:
- Country/Region
- USA
