A method for fabricating micromachined structures is provided. At least one cavity is formed on a substrate and then a dielectric material different from the material of the substrate is filled in the at least one cavity. Next, a circuitry layer including a first etch-resistant layer and a dielectri.....
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A direct-lit type backlight source includes a backplate and a point light source array disposed on the backplate. A light output shape of a first optical lens employed by each of point light sources of corner regions of the point light source array and that of a second optical lens employed by each .....
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The present disclosure discloses a stereoscopic integrated LED light source module, which comprises a columnar insulated support, a plurality of conducting circuits located on outer surface of the columnar insulated support, a plurality of LED light sources connected the conducting circuits to form .....
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La présente invention révèle une structure d'un seul tenant incluant une antenne et un couvercle de blindage de même que son module sans fil. La structure comprend en outre des première et seconde plaques conductrices. L'antenne permet une émission/réception de signal et le couvercle de blindage évi.....
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The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on .....
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