A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering .....
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A semiconductor element and a manufacturing method thereof are provided. The semiconductor element includes a substrate and multiple semiconductor chips disposed thereon. The semiconductor chips are arranged to form multiple sequentially nested circle(s), and a circumference of each of which is arra.....
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The present disclosure discloses a stereoscopic integrated LED light source module, which comprises a columnar insulated support, a plurality of conducting circuits located on outer surface of the columnar insulated support, a plurality of LED light sources connected the conducting circuits to form .....
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La présente invention révèle une structure d'un seul tenant incluant une antenne et un couvercle de blindage de même que son module sans fil. La structure comprend en outre des première et seconde plaques conductrices. L'antenne permet une émission/réception de signal et le couvercle de blindage évi.....
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The present invention provides an apparatus and method for controlling power and clock speed of an electronic system. The present invention detects a voltage signal and a current signal as the electronic system is operating, and obtains a power value. The present invention decides whether the power .....
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