Dirk Englund, Ph.D.
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A compact active vapor compression cycle heat transfer device.
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Accuratelymonitors thermal distribution across microchip within 1°C accuracyIntegratesdirectly into microchipRequiresminimal changes to silicon layoutMaintainsaccuracy after microchip process and temperature variationsRequiresminimal space for thermal sensingMinimizessupport circuitryEliminatesneed .....
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A novel high speed photodetector/receiver was created that is completely integrated in silicon-based commercial logic processes (BiCMOS), and provides higher performance at a lower cost than existing devices.
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The technology addresses the insider threat through the development of a novel non-identity-based access control mechanism that determines why access is being requested as opposed to identifying who has requested access.
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