Bonding method for through-silicon-via based 3D wafer stacking
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Magnetic induction devices are widely used in electronic and communication devices. To further reduce surface area consumption for induction devices, the research team has proposed a monolithic magnetic induction device having low DC resistance and low surface area. The new device comprises a substr.....
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Garments are often made from a blend of different fibres in order to improve fit, style, comfort and longevity. As yet no commercially viable separation and recycling technologies are available in the industry for the most popular blends such as cotton and polyester blends. This project has develope.....
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A family of new mechanical presses is invented. This type of presess is programmable (including its stroke, speed and acceleration) and energy-efficient (it uses a flywheel to ease the peak energy). Mechanically, it is a 2 degree-of-freedom punching mechanism driven by two different motors (a commo.....
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A variety of new mesogen-containing acetylenes are prepared and designed. A research team at the HKUST developed new catalyst systems for polymerizing the functional acetylene monomers and manufactured the novel liquid crystalline polyacetylenes. In this new invention, the new side-chain liquid cr.....
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