With the development of ball grid array (BGA), the strength of BGA becomes important. High speed single solder ball test is one effective method to test BGA strength. This design provides one machine to test single sold ball strength at high speed. The advantage of this design is multi-solder balls .....
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Electroplating-based flip chip solder preparation process had been widely used over other preparation methods. Although it is cheaper and is able to achieve the material deposition on the fine pitch I/O pads, the solder bumps resulted are not uniform and not quality-guaranteed. In this invention, ma.....
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In heavy metal producing industries such as electroplating, metal-finishing, steels, chemical manufacturing, leather tanning, the handling of effluent has always been the main concern. Improper treatment to the wastewater before it is drained out into rivers or oceans will cause a great pollution an.....
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Power management is necessary to reduce standby power consumption of low-power portable applications such as mobile phones and personal digital assistants (PDAs). A low-dropout regulator (LDO) is a type of voltage regulator that is widely utilized in power management integrated circuits. In order to.....
[Detail]
A thin film transistor (TFT) is an insulated-gate field effect transistor that is fabricated using thin film techniques on an insulating substrate rather than a semiconductor. Integrated circuits (IC) built using polysilicon thin film transistors at low temperatures have attracted much attention in .....
[Detail]
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