A semiconductor element and a manufacturing method thereof are provided. The semiconductor element includes a substrate and multiple semiconductor chips disposed thereon. The semiconductor chips are arranged to form multiple sequentially nested circle(s), and a circumference of each of which is arra.....
[Detail]
A coupling structure includes a hook bar and a force receiving member adopted for use on an electronic device that has a folding member such as a notebook computer that consists of an upper lid and a base. The folding member is the upper lid. The force receiving member and the hook bar have respecti.....
[Detail]
A motion estimation method for a succession of frames in a digital coding system includes: with reference to a first block in a first frame, searching a second frame for a second block that corresponds to the first block; and estimating a motion vector of the first block with respect to the second b.....
[Detail]
The present invention provides an apparatus and method for controlling power and clock speed of an electronic system. The present invention detects a voltage signal and a current signal as the electronic system is operating, and obtains a power value. The present invention decides whether the power .....
[Detail]
A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering .....
[Detail]
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