A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering .....
[Detail]
A semiconductor element and a manufacturing method thereof are provided. The semiconductor element includes a substrate and multiple semiconductor chips disposed thereon. The semiconductor chips are arranged to form multiple sequentially nested circle(s), and a circumference of each of which is arra.....
[Detail]
The present disclosure discloses a stereoscopic integrated LED light source module, which comprises a columnar insulated support, a plurality of conducting circuits located on outer surface of the columnar insulated support, a plurality of LED light sources connected the conducting circuits to form .....
[Detail]
