Mutation of the RSV NS1/2 proteins to attenuate the virus and boost immunogenicity
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Dr. Seok Kim from the University of Illinois at Urbana-Champaign has developed a method for assembling 3D architectures out of heterogeneous materials used to make MEMs devices.
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Resolves the transparency drawback of the conventional art, Utilization of new polymers provides better optoelectronic properties, Improved interfacial layer properties, Well-controlled coating method maximizes solar efficiency
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