亞洲知識產權資訊網為知識產權業界提供一個一站式網上交易平台，協助業界發掘知識產權貿易商機，並與環球知識產權業界建立聯繫。無論你是知識產權擁有者正在出售您的知識產權，或是製造商需要購買技術以提高操作效能，又或是知識產權配套服務供應商，你將會從本網站發掘到有用的知識產權貿易資訊。

返回搜索結果

Manifold Microchannel with Patterned Nanowire for Heat Transfer Enhancement

*Abstract: Manifold Microchannel HeatsinkIn the world of electronics there is always a need for better and more compact cooling systems. This is especially true as the demand for increased processing power in everything from military grade technology to desktop computers continues to grow. Heatsinks using microchannels have some promising results in this regard. This technology comprises specialized nanostructures and a feeding manifold, which allow for much more stable two-phase flow, low flow resistance, and high heat transfer capabilities when compared to other two-phase flow microchannel devices. Additionally, the patterning of the nanostructures creates a swirling/mixing effect for better heat transfer. These improvements to thermal performance and pressure drop reduction greatly increase this technologies viability in the marketplace.Potential Areas of Application• Military electronics • High performance computing Patent Status: Patent PendingInventor: Chung-Lung Chen, Hsiu-Hung Chen, and Sheng WangContact: Wayne McDaniel, mcdanielwc@missouri.edu or (573) 884-3302; Brian Matlock, matlockk@missouri.edu or (573) 882-8963

*Principal Investigation: Name: Chung-Lung Chen, Endowed Professor
Department:

Name: Hsiu-Hung Chen
Department:

Name: Sheng Wang, Assistant Research Professor
Department:

欲了解更多信息，請點擊這裡