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Manifold Microchannel with Patterned Nanowire for Heat Transfer Enhancement

*Abstract: Manifold Microchannel HeatsinkIn the world of electronics there is always a need for better and more compact cooling systems. This is especially true as the demand for increased processing power in everything from military grade technology to desktop computers continues to grow. Heatsinks using microchannels have some promising results in this regard. This technology comprises specialized nanostructures and a feeding manifold, which allow for much more stable two-phase flow, low flow resistance, and high heat transfer capabilities when compared to other two-phase flow microchannel devices. Additionally, the patterning of the nanostructures creates a swirling/mixing effect for better heat transfer. These improvements to thermal performance and pressure drop reduction greatly increase this technologies viability in the marketplace.Potential Areas of Application• Military electronics • High performance computing Patent Status: Patent PendingInventor: Chung-Lung Chen, Hsiu-Hung Chen, and Sheng WangContact: Wayne McDaniel, mcdanielwc@missouri.edu or (573) 884-3302; Brian Matlock, matlockk@missouri.edu or (573) 882-8963

*Principal Investigation: Name: Chung-Lung Chen, Endowed Professor
Department:

Name: Hsiu-Hung Chen
Department:

Name: Sheng Wang, Assistant Research Professor
Department:

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