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High Voltage N-Channel Insulated Gate Bipolar Transistor (IGBT) in Silicon Carbide

總結
A Purdue University researcher has developed a method and process for fabricating IGBTs in SiC. The method avoids the high resistance introduced from substrates in current manufacturing methods, while preserving the advantages of an N-type MOS channel.
技術優勢
Provides enhanced conductivityP+ substrates are removed Very high parasitic saves resistance
技術應用
MaterialsManufacturingCircuitryMicroelectronicsNanoelectronics
詳細技術說明
James Cooper Jr.Purdue Electrical and Computer Engineering
*Abstract

*Background
Insulated Gate Bipolar Transistors (IGBTs) combine the low drive characteristic of metal oxide semiconductor field effect transistors and the high power handling characteristic of bipolar transistors. These features make IGBTs ideal for high voltage switching applications. The use of silicon carbide as a process material yields IGBTs with even higher breakdown voltage capability, but introduces high parasitic series resistance.
*IP Issue Date
Jan 1, 2013
*IP Type
Divisional
*Stage of Development
Prototype Testing
*Web Links
Purdue Office of Technology CommercializationPurdueInnovation and EntrepreneurshipJames Cooper Jr.Purdue Electrical and Computer Engineering
國家
United States
申請號碼
8,343,841
國家/地區
美國

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