Reduction in Leakage Current and Increase in Efficiency of III-Nitride MicroLEDS
- Technology Benefits
- Hydrogen-free sidewall passivation No increase in resistivity for p-type layers No decrease in transparency for ITO
- Technology Application
- Smart phones Smart watches “Near eye” devices that require ultra-low current
- Detailed Technology Description
- Researchers at the University of California, Santa Barbara have developed a way to reduce leakage current and increase the efficiency of III-Nitride microLEDs via ALD sidewall passivation. ALD has atomic-scale control on the deposition rate of dielectrics thin film. The dielectric film is sufficient to passivate the sidewall of LEDs and to reduce leakage current for microLEDs. Furthermore, ALD is a hydrogen-free deposition method which prevents the problem of hydrogen passivation, thus increasing the efficiency of the LEDs.
- Others
-
Background
Due to the chemical inertness of III-nitrides semiconductor materials, plasma-based dry etching is widely employed to define the mesa structure of LEDs. Due to the high-energy nature of plasma etching, the sidewall of the LED has defects which result in leakage current and reduction of internal quantum efficiency. There are currently techniques to try to minimize these problems. Sidewall passivation using dielectrics has been demonstrated and used to decrease the leakage current and plasma-enhanced chemical vapor deposition (PECVD) is the common technique for deposition dielectrics to passivate the sidewall. However, as the size of LED diminishes, it is easier for hydrogen to diffuse into LEDs, lowering the efficiency. This results in less light being extracted from the LED. MicroLEDs are used in a number of “Near-eye” display devices, which have very low current in order to avoid retina damage. As a result, microLEDs with very low leakage current are desired.
Additional Technologies by these Inventors
- Reduced Dislocation Density of Non-Polar GaN Grown by Hydride Vapor Phase Epitaxy
- Growth of Planar, Non-Polar, A-Plane GaN by Hydride Vapor Phase Epitaxy
- Nonpolar (Al, B, In, Ga)N Quantum Well Design
- Cleaved Facet Edge-Emitting Laser Diodes Grown on Semipolar GaN
- Enhancing Growth of Semipolar (Al,In,Ga,B)N Films via MOCVD
- GaN-Based Thermoelectric Device for Micro-Power Generation
- Growth of High-Quality, Thick, Non-Polar M-Plane GaN Films
- Growth of Planar Semi-Polar Gallium Nitride
- Defect Reduction of Non-Polar and Semi-Polar III-Nitrides
- MOCVD Growth of Planar Non-Polar M-Plane Gallium Nitride
- Low Temperature Deposition of Magnesium Doped Nitride Films
- Improved Manufacturing of Solid State Lasers via Patterning of Photonic Crystals
- Single or Multi-Color High Efficiency LED by Growth Over a Patterned Substrate
- High Efficiency LED with Optimized Photonic Crystal Extractor
- Packaging Technique for the Fabrication of Polarized Light Emitting Diodes
- LED Device Structures with Minimized Light Re-Absorption
- (In,Ga,Al)N Optoelectronic Devices with Thicker Active Layers for Improved Performance
- Oxyfluoride Phosphors for Use in White Light LEDs
- III-V Nitride Device Structures on Patterned Substrates
- Growth of Semipolar III-V Nitride Films with Lower Defect Density
- Enhanced Optical Polarization of Nitride LEDs by Increased Indium Incorporation
- Semipolar-Based Yellow, Green, Blue LEDs with Improved Performance
- Hexagonal Wurtzite Type Epitaxial Layer with a Low Alkali-Metal Concentration
- Photoelectrochemical Etching Of P-Type Semiconductor Heterostructures
- Highly Efficient Blue-Violet III-Nitride Semipolar Laser Diodes
- Defect Reduction in GaN films using in-situ SiNx Nanomask
- Semi-polar LED/LD Devices on Relaxed Template with Misfit Dislocation at Hetero-interface
- Limiting Strain-Relaxation in III-Nitride Heterostructures by Substrate Patterning
- Suppression of Defect Formation and Increase in Critical Thickness by Silicon Doping
- High Efficiency Semipolar AlGaN-Cladding-Free Laser Diodes
- Low-Cost Zinc Oxide for High-Power-Output, GaN-Based LEDs (UC Case 2010-183)
- Low-Cost Zinc Oxide for High-Power-Output, GaN-Based LEDs (UC Case 2010-150)
- Method for Increasing GaN Substrate Area in Nitride Devices
- Flexible Arrays of MicroLEDs using the Photoelectrochemical (PEC) Liftoff Technique
- Optimization of Laser Bar Orientation for Nonpolar Laser Diodes
- UV Optoelectronic Devices Based on Nonpolar and Semi-polar AlInN and AlInGaN Alloys
- Low-Droop LED Structure on GaN Semi-polar Substrates
- Improved Fabrication of Nonpolar InGaN Thin Films, Heterostructures, and Devices
- Growth of High-Performance M-plane GaN Optical Devices
- Method for Enhancing Growth of Semipolar Nitride Devices
- Transparent Mirrorless (TML) LEDs
- Solid Solution Phosphors for Use in Solid State White Lighting Applications
- Technique for the Nitride Growth of Semipolar Thin Films, Heterostructures, and Semiconductor Devices
- Planar, Nonpolar M-Plane III-Nitride Films Grown on Miscut Substrates
- High-Efficiency, Mirrorless Non-Polar and Semi-Polar Light Emitting Devices
- High Light Extraction Efficiency III-Nitride LED
- Tunable White Light Based on Polarization-Sensitive LEDs
- Method for Improved Surface of (Ga,Al,In,B)N Films on Nonpolar or Semipolar Subtrates
- Improved Anisotropic Strain Control in Semipolar Nitride Devices
- III-Nitride Tunnel Junction with Modified Interface
- Enhanced Light Extraction LED with a Tunnel Junction Contact Wafer Bonded to a Conductive Oxide
- Increased Light Extraction with Multistep Deposition of ZnO on GaN
- Hybrid Growth Method for Improved III-Nitride Tunnel Junction Devices
- Contact Architectures for Tunnel Junction Devices
- New Blue Phosphor for High Heat Applications
- Methods for Fabricating III-Nitride Tunnel Junction Devices
- Laser Diode System For Horticultural Lighting
- Fabricating Nitride Layers
- Vertical Cavity Surface-Emitting Lasers with Continuous Wave Operation
- Laser Lighting System Incorporating an Additional Scattered Laser
Tech ID/UC Case
29198/2018-256-0
Related Cases
2018-256-0
- *Abstract
-
A way to reduce leakage current and increase the efficiency of III-Nitride microLEDs via ALD sidewall passivation.
- *Principal Investigator
-
Name: Abdullah Alhassan
Department:
Name: Steven DenBaars
Department:
Name: David Hwang
Department:
Name: Matthew Wong
Department:
- Country/Region
- USA
