Solventless, Resistless, Direct Dielectric Patterning
- Detailed Technology Description
- A novel process was developed for lithographically patterning a material on a substrate that greatly reduces wastes to provide a much more environmentally and economically friendly microelectronics fabrication method.
- *Abstract
-
A novel process was developed for lithographically patterning a material on a substrate that greatly reduces wastes to provide a much more environmentally and economically friendly microelectronics fabrication method. The method, which can produce two- and three-dimensional features in the dielectric layer with dimensional tolerances better than 7%, uses a unique chemical vapor deposition process to eliminate the need for photoresists and solvents. With both economic and environmental benefits, this straight-forward process promises to find wide application in the microelectronics industry.
Potential Applications
- Semiconductor fabrication
Advantages
- Greatly reduced waste
- Simplified process reduces the number of required fabrication steps
- *Licensing
- Martin Teschlmt439@cornell.edu(607) 254-4454
- Country/Region
- USA
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